<< If the BGA pitch spacing allows it then this style of routing may be a better option than via-in-pad. • Ball pitch For example: TFBGA = 1.2mm package height and less than 1.0mm ball pitch. BGA Socket, BGA IC, BGA CPU, BGA Pitch, Test Socket, BGA Chip, BGA Processor, BGA Adapter, BGA Package, BGA LGA, BGA Component, CSP BGA, BGA Ball, Socket 1168 BGA, Fcbga Socket, QFN BGA, PGA CPU Socket, BGA Device, BGA IC Package Style, Micro BGA, BGA Ball Grid Array, LGA vs PGA Socket, BGA Parts, CPU Socket Types, Pogo Pin Socket, Electronic Socket, BGA Interposer, Intel CPU Socket, BGA Pitch … PCB designers have become used to shrinking board sizes, pad sizes, via sizes, and component sizes. endobj With bumps spread throughout the area of a BGA package, even though the I/O pitch is greater, the overall size is smaller and up to 1,000 I/O bumps are possible. Also, PCB fabrication problems surface when running multiple and thin 2 to 3 mil traces between two BGA pads. One is to maintain pad size to about 85 % of a BGA’s ball size. 3 Solder Mask Defined Pads Versus Non-solder Mask Defined Pads ince the AM572x BGA has 0.80 mm ball pitch, it is recommended that non-solder-mask-defined (NSMD) PCB pads be used for mounting the device to the … /ExtGState << BGA Math?Calculate BGA routing layer requirements?Select ball size?Subtract ball size from ball pitch?Calculate number of traces between pads?Add 1 for outside row of pads?Subtract via size from ball pitch ?Calculate number of traces between vias?Add 1 for outside row of pads?Add via and pads escapes together? /Ascent 1079 In addition, components with high I/O count come packaged in smaller footprints with finer pad pitch, making routing very difficult without the right design tools. 1374 0 obj Another is to use a non-solder mask defined (NSMD) pad. Why BGA Components • Peripheral devices with 1.00 mm pitch have become commonplace, however these packages cannot accommodate more than 84 pins. >>] /Type /Font Fine pitch packages offer advantages and disadvantages alike. 0000037923 00000 n Less expensive surface mount equipment—BGA packages can tolerate slightly imperfect placement during mounting, requiring less expensive surface mount equipment. Find 0.5mm on the left hand column and follow that to the column that says “Nominal Land Diameter” and see that the recommendation for the ball pad is 0.4mm. endobj endobj 0000039138 00000 n In this case, the solder mask is larger than the BGA pad. endobj 0000035490 00000 n Clamshell THT socket solution for different BGA and LGA packages from 0.65mm up to 1.00mm pitch; Available in 3 pitch sizes and various depopulation versions; V-shape contact structure prevents any damage of coplanarity of the ball contacts ; View product. /F 575 0 R SnPb and RoHS Pb-Free (Lead Free). 0 0 0 723 0 0 0 0 0 0 Better yields and results are achieved for these particular PCB designs. First is the interstitial PGA package at about 70mil effective cen-ters. Moreover, the least distance to the circuit line is around 0.2 mm. Some CSP (chip scale package) or WSP (wafer scale package) BGA and LGA parts are starting to show up in 0.4mm pitch, as well as some bigger parts like the Ti OMAP processor. 1377 0 obj 653 561 0 723 667 0 0 0 0 0 /FontFamily (Segoe UI) >> 1370 0 obj According to those tables for BGA with pitch of 0.8mm and ball diameter 0.5mm the following applies: Nominal landing diameter (copper pad size) = 0.4mm ± 0.05mm via copper (outer) diameter = … /Metadata 1381 0 R In the case of 0.3mm pitch devices, if the same guidelines are used, it can lead to potential failures during manufacturing or in the field. /PageLayout /SinglePage Pitch. endobj 1373 0 obj /Filter /FlateDecode 0000035144 00000 n Nowadays, precise components is widely used in some advanced electronics devices, such as fine pitch FPGA component from Xilinx. /FontStretch /Normal From a performance perspective, the thermal and electrical characteristics can be better than that of conventional QFPs or PQFPs. The solder-mask is then opened with about the same aperture as the BGA ball, size. Ask Question Asked 9 years, 11 months ago. /Flags 32 Three pitch sizes are available for these packages: 1.0 mm, 0.8 mm, and 0.5 mm. /BaseFont /HKFIEG+SegoeUI,Bold Keep in mind that ball size of 0.4mm pitch BGAs are smaller than those of 0.5mm pitch BGAs. >> It’s a good idea for the seasoned PCB designer to perform preliminary experimental layouts and prototype rounds to get the lay of the design before launching into a full-fledged layout. 1371 0 obj issue (KGD) • Soldering difficulties • PWB/ASSY cost up CSP (chip scale pkg.) Active 5 years, 3 months ago. 1366 0 obj 0000003796 00000 n /Root 1364 0 R Reducing pad size further may cause an insufficient solder-able area on the BGA pads. 2. Editorial Change. size LGA and a BGA version of the same device. As the BGA package is usually meant for FPGA and microcontrollers, the number of pins underneath the IC could range between 200s to 2000s. /LC /iSQP SAC balls for I/O soldering connections. The via pattern for the board, however, required tighter feature control. In the case of 0.3mm pitch devices, if the same guidelines are used, it can lead to potential failures during manufacturing or in the field. NSMD and SMD pad comparison is shown in Fig. 0000037754 00000 n /FontWeight 700 Package descriptors F1 through F6 have been added to provide more detailed ball pitch 1369 0 obj 0000005248 00000 n Having them introduces shorts at pitches of 0.4mm and smaller on external layers. /TT4 1373 0 R endobj 0000034966 00000 n This means the PCB designer must be on top of his/her game, and certainly not be complacent after successfully completing many 0.5mm pitch and above BGA-based designs. 0000002220 00000 n >> /PageLabels 1347 0 R Micro-via sizes can get down to 8 mils with a 4 mil hole depending on the capabilities of the PCB manufacturer. It is safe to predict there’s an increasing need of more processing power in products like wearables, IoT devices, and embedded medical devices. %%EOF (2-1) If the BGA pitch >1.0mm, then the aperture size should be a 1:1 scale opening. /FontDescriptor 1375 0 R In a BGA the pins are replaced by pads on the bottom of the package, each initially with a tiny solder ball stuck to it. (2-2) If the BGA pitch 0.5mm, then the aperture size should be 95% of the pad’s size. /Font << It has 4-5 mil trace/space, with 4-mil lasers and 8-mil pads. If not, what's the most economical set of dimensions to use? In this case, the solder mask is larger than the BGA pad. /ColorSpace << 0000002482 00000 n 2c – Side view of NSMD CSP/BGA solder joints and NSMD CSP/BGA solder joints (Source: Altera Corporation application note) Now, consider that the solder-ball dimension for 0.3 mm pitch mini-CSP components is extremely small – less than 8.2 mil. 0.4mm fine pitch BGA PCB Design guideline July 21, 2020 By Carl Zhu 945 views Nowadays, precise components is widely used in some advanced electronics devices, such as fine pitch … << << The recessed solder mask provides stress relief to the NSMD pad during reflow. 0000037125 00000 n 1368 0 obj Whenever traces are routed between 0.4, 0.5 and 0.65 pitch, the BGA pads on the outer layers, the solder mask size and the tolerance must be considered. Keep in mind that ball size of 0.4mm pitch BGAs are smaller than those of 0.5mm pitch BGAs. With the NSMD method, the opening in the (Source: Actel Corporation application note) Distance is 11.8 mils between the center of a pad and the center of next pad. Finer pitch means that the trace and space limits will have to be adjusted down to match the BGA. 0000004638 00000 n >> /BG2 /Default For 0.2mm ultra-fine pitch BGA design, it is strongly advised to use via-in-pad technology since there is no room to perform a dog-bone type fan-out. Pitch. Committee(s): JC-11.2 JEP95 Registrations Main Page At that size, you start to see more risk of solder bridging with NSMD pads, as in the left side of the illustration below. 0000034841 00000 n Subtract via size from ball pitch ?Calculate number of traces between vias?Add 1 for outside row of pads?Add via and pads escapes together?This is the number of rows that can be routed in 2 layers?Number of traces between vias for additional rows per layer. However, there are other considerations if BGA and QFN/QFP ICs are involved. 0000037518 00000 n /ItalicAngle -15 ����9��*���Cu� ��RvLJ������0?�c?J���! xref << 0000005318 00000 n The solder mask is usually opened to a diameter of about the ball size of the BGA. Spacing and dimensions for a 0.5mm-pitch WLP. The advent of array component packages made pitch more forgiving.
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